A challenging task in preparation real physical boards is to ensure that the PCBs fits the physical mounting constraints as well the electrical and thermal requirements. The most important electrical and thermal requirements are checked by the simulation of the real working condition for the produced PCBs. To do such a realistic simulation it is essential to transfer the copper in all layers which will be produced on the board. The MECODES tool allows CAD engineers to exchange a full set of the copper traces distributed over all layers on the PCB stack.
Realistic virtual simulation of the Electromagnetic compatibility and the thermal and electrical characteristics of the PCB relies on the full 3D component representation with the accurate placement of components, electrical and dielectric properties, the geometric dimensions, in the composed electro-mechanical model. The specified components in the MECODES library and the filled copper vias in the PCB layer stack with the exact dimension of the copper vias and traces transferred into the mechanical model of CATIA V5 or 3DEXPERIENCE allow accurate simulations and create real results.
Trace with the surface or solid trace
New algorithms for faster trace generation are based on EDMD protocol. Copper planes (including internal layers) are also supported. The user can choose to use surface traces or solid traces with thickness so all copper can be visible in CATIA in two ways.
Two algorithms for wires in CATIA are developed.
- Surface wire for quick clearance check and for high density PCB and for thermal simulation
- Solid wire with real wire thickness from PCB layer stack-up definition in ECAD tools for real 3D simulation