Skip to main content
Back to top
Background image 1

Multilayer PCB design with ODB++

PCB layer stackup with the exact dimension of the copper vias and traces are transferred into the mechanical model which allows accurate simulations and create real results.

A challenging task in preparing real physical boards is to ensure that the PCBs fits the physical mounting constraints as well the electrical and thermal requirements. The most important electrical and thermal requirements are checked by the simulation of the real working condition for the produced PCBs. To do such a realistic simulation it is essential to transfer the copper in all layers which will be produced on the board. The MECODES allows CAD engineers to exchange a full set of the copper traces distributed over all layers on the PCB stack.

Realistic virtual simulation of the Electromagnetic compatibility and the thermal and electrical characteristics of the PCB relies on the full 3D component representation with the accurate placement of components, electrical and dielectric properties, the geometric dimensions, in the composed electro-mechanical model. The specified components in the MECODES library and the filled copper vias in the PCB layer stack with the exact dimension of the copper vias and traces transferred into the mechanical model of CATIA V5 or 3DEXPERIENCE allow accurate simulations and create real results.

Picture: View of filled Vias within a multilayer board in CATIA V5

MECODES supports: Collaboration on several PCB projects in parallel, integration of several PCB projects in one electro-mechanical product assembly model, design of complex products consistent with required product functionality and dimensions, interconnection between several boards for simulation, analysis and signal integrity.



See MECODES in action

EDMD Protocol

Last minute change scenario

ECAD – MCAD Library

Copper import with MECODES

Transaction history