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One of the central features in the MECODES collaboration environment is the common PCB library management system, which represents the key element in the ECAD/MCAD collaboration. The MECODES common library management system is featured by a component update for users who wish to extend the library with new components or modify the existing ones. The common library additionally stores the transformation matrix which controls the placement of the component in CATIA V5 or 3DEXPERIENCE model, consequently, reducing the risk of misplacing components on the PCB.
The richness of the stored PCB data allows MECODES enabled clients on the MCAD side to show a full picture of the ECAD model within the workspace of CATIA V5 or 3DEXPERIENCE.
New algorithms for faster trace generation are based on EDMD protocol. Copper planes (including internal layers) are also supported. The user can choose to use surface traces or solid traces with thickness so all copper can be visible in CATIA in two ways:
Realistic virtual simulation of the Electromagnetic compatibility and the thermal and electrical characteristics of the PCB relies on the full 3D component representation with the accurate placement of components, electrical and dielectric properties, the geometric dimensions, in the composed electro-mechanical model. The specified components in the MECODES library and the filled copper vias in the PCB layer stack with the exact dimension of the copper vias and traces transferred into the mechanical model of CATIA V5 or 3DEXPERIENCE allow accurate simulations and create real results.
A challenging task in mounting real physical boards with the mechanical housing is to ensure that the PCBs fits the mounting constraints as well as the electrical and thermal requirements. Important electrical and thermal requirements are verified by the simulation composed mechanical and equipped PCB(s). It is essential to transfer the copper in all layers to receive realistic simulation results which will allow being produce integrated electro-mechanical products. The MECODES solution allows designers to implement all vias filled with copper, in addition to the copper traces on the different layers of the PCB stack, in the integrated model.
In cases where physical prototypes take months to build, engineers are very careful about deciding upon design options. These challenges may slow down the innovation process as well as the implementation of new ideas. The MECODES transaction history facilitates engineers to gain real insights into the responses of the product to their decisions. The documented transaction history and the associated designed models also allow the “what-if” analysis to be successfully performed as to optimize the required product properties and performance.